125-22絲網(wǎng)印刷B級(jí)導(dǎo)電低CTE環(huán)氧粘合劑

說(shuō)明

125-22是一種可絲網(wǎng)印刷的B級(jí)導(dǎo)電單組分環(huán)氧粘合劑，適用于

通過(guò)絲網(wǎng)印刷和注射器分配。125-22設(shè)計(jì)用于在粘合過(guò)程中顯示小流量。這個(gè)產(chǎn)品

在將電路材料與金屬背平面和熱連接時(shí)提供優(yōu)異的導(dǎo)電性和導(dǎo)熱性

下沉。本產(chǎn)品對(duì)銅、鋁、陶瓷等多種基材具有優(yōu)異的附著力。

其他應(yīng)用包括但不限于組裝電氣和電子部件。這個(gè)系統(tǒng)

具有良好的熱穩(wěn)定性和靈活性的形式。

特色

固化過(guò)程中的小流量低CTE

B-可分級(jí)屏幕壽命長(zhǎng)

優(yōu)異的耐化學(xué)性?xún)?yōu)異的高溫性能

典型未固化特性

財(cái)產(chǎn)價(jià)值單位

粘度——布魯克菲爾德帽子粘度計(jì)，

25°C時(shí)10轉(zhuǎn)/分20000–30000 cps

比重（水=1）1.88 g/cc

理論覆蓋率@0.001“厚度1~30 in2

屏幕壽命>8小時(shí)

填充銀-

1取決于篩網(wǎng)和材料

典型固化性能

財(cái)產(chǎn)價(jià)值單位

體積電阻率，0.001Ω-cm

熱導(dǎo)率6.5 w/mk

銀含量，固化>60-

熱穩(wěn)定性高達(dá)325攝氏度

有效溫度范圍-55至230攝氏度

玻璃化轉(zhuǎn)變溫度-TG 150°C

熱膨脹系數(shù)-低于TG 50 x 10-6 in/in/℃

-高于TG 60 x 10-6英寸/英寸/攝氏度

拉伸剪切強(qiáng)度，小2000 psi

剝離強(qiáng)度（90°時(shí)銅對(duì)銅）9 pli

所有技術(shù)信息均基于CMI人員獲得的數(shù)據(jù)，并被認(rèn)為是可靠的。沒(méi)有保證是

關(guān)于結(jié)果或可能侵犯的明示或暗示的。

修訂日期：11/12/09修訂：A

第2頁(yè)，共2頁(yè)

固化指南

溫度（攝氏度）時(shí)間（分鐘）

160 60個(gè)

17530個(gè)

200 15個(gè)

搬運(yùn)和儲(chǔ)存

材料在收到后即可使用。存儲(chǔ)凍結(jié)以保持*的流屬性。使材料預(yù)熱

在打開(kāi)容器前達(dá)到室溫。在使用之前，重新使用任何固定的填料是很重要的。小心

攪拌時(shí)不可截留空氣。125-22可以用少量cmi 113-12（快干）或102-03稀釋

（慢干）稀釋劑。

保質(zhì)期

儲(chǔ)存溫度容器B級(jí)薄膜

25°C 2個(gè)月1個(gè)月

-10°C 6個(gè)月3個(gè)月

B階段程序

在基材或剝離襯墊上涂上粘合劑。下一步加熱以將固化推進(jìn)到非粘性階段

冷卻到室溫。要求溫度為100°C至120°C，持續(xù)5至15分鐘，B級(jí)時(shí)間為

與質(zhì)量有關(guān)。鼓勵(lì)用戶(hù)在給定溫度下試驗(yàn)干燥時(shí)間。

粘合程序

使用時(shí)，在一個(gè)零件上涂抹B級(jí)粘合劑，小心地對(duì)齊要粘合的零件，施加均勻的壓力以保持

地點(diǎn)。在200°C下固化15分鐘，或在175°C下固化30分鐘，或在160°C下固化1小時(shí)，以獲得更好的粘合效果

薄膜到部分，建議將該部分加熱到40°C。給定的固化時(shí)間與質(zhì)量有關(guān)，正時(shí)

應(yīng)在粘合劑和基材達(dá)到固化溫度后開(kāi)始。

健康與安全

在充分通風(fēng)的情況下使用。遠(yuǎn)離火花和明火。避免長(zhǎng)時(shí)間接觸皮膚和

吸入蒸汽。用肥皂和水清洗皮膚。

125-22絲網(wǎng)印刷B級(jí)導(dǎo)電低CTE環(huán)氧粘合劑

 125-22
SCREEN-PRINTABLE, B-STAGEABLE, ELECTRICALLY CONDUCTIVE, LOW CTE, EPOXY ADHESIVE
DESCRIPTION
125-22 is a screen-printable, B-Stageable, electrically conductive, one part epoxy adhesive, suitable for application
by screen-printing and syringe dispensing. 125-22 is designed to exhibit minimal flow during bonding. This product
provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat
sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates.
Additional applications include, but are not limited to, assembling electrical and electronic components. This system
features excellent thermal stability and flexibility in the B-Staged form.
UNIQUE FEATURES
? Minimal flow during cure ? Low CTE
? B-Stageable ? Long Screen Life
? Excellent Chemical Resistance ? Excellent High Temperature Performance
TYPICAL UNCURED PROPERTIES
Property Value Units
Viscosity – Brookfield HAT Viscometer,
10 rpm @ 25°C 20,000 – 30,000 cps
Specific Gravity (water = 1) 1.88 g/cc
Theoretical Coverage @ 0.001” Thickness1 ~ 30 in2
Screen Life > 8 hrs
Filler Silver -
1 Dependent on screen mesh and material
TYPICAL CURED PROPERTIES
Property Value Units
Volume Resistivity, max 0.001 Ω - cm
Thermal Conductivity 6.5 W/mK
Percent Silver, cured > 60 -
Thermal Stability Good to 325 º C
Useful Temperature Range -55 to 230 º C
Glass transition Temperature – Tg 150 º C
Coefficient of Thermal Expansion - Below Tg 50 x 10-6 in/in/°C
 - Above Tg 60 x 10-6 in/in/°C
Tensile Shear Strength, min 2000 Psi
Peel Strength (Copper to copper @ 90°) 9 Pli
All technical information is based on data obtained by CMI personnel and is believed to be reliable. No warranty is
either expressed or implied with respect to results or possible infringements on patents.
REVISION DATE: 11/12/09 REVISION: A
Page 2 of 2
CURING GUIDELINES
Temperature (ºC) Time (min.)
 160 60
 175 30
 200 15
HANDLING AND STORAGE
Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up
to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful
not entrap air while mixing. 125-22 can be thinned with small amounts of CMI# 113-12 (fast drying), or #102-03
(slow drying) thinners.
 SHELF LIFE
Storage Temperature Containers B-Staged Film
 25°C 2 months 1 month
-10°C 6 months 3 months
B-STAGE PROCEDURE
Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when
cooled to room temperature. A temperature of 100°C to 120°C for 5 to 15 minutes is required, B-Stage time is
mass related. User is encouraged to experiment for optimum drying time at a given temperature.
BONDING PROCEDURE
To use, apply b-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain
location. Cure for 15 minutes at 200°C, or 30 minutes at 175°C, or 1 hour at 160°C. For better adhesion of the bstaged
film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing
should start after adhesive and substrates reach curing temperature.
HEALTH AND SAFETY
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and
breathing of vapors. Wash with soap and water to remove from skin.