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            Helios 5 Laser PFIB System
            • Helios 5 Laser PFIB System

            貨物所在地:上海上海市

            更新時間:2024-12-06 21:00:07

            瀏覽次數(shù):201

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            Helios 5 Laser PFIB System
            由于新 PFIB 色譜柱可實現(xiàn) 500 V Xe+ 最終拋光和所有操作條件下的優(yōu)異性能,因此可以實現(xiàn)高質(zhì)量、無鎵 TEM 和 APT 樣品制備。

            Helios 5 Laser PFIB System

            FIB SEM laser tool for high throughput millimeter scale cross sectioning and 3D characterization with nanometer resolution

            The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

            Key Features


            Fast material removal

            Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

            Accurate and repeatable cut placement

            The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

            High throughput processing of challenging materials

            Includes non-conductive or ion-beam-sensitive samples.

            Shares all capabilities of the Helios 5 PFIB platform

            High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.

            Statistically relevant subsurface and 3D data analysis

            Acquire data for much larger volumes within a shorter amount of time.

            Fast characterization of deep subsurface features

            Extraction of subsurface TEM lamella or chunks for 3D analysis.

            Fast and easy characterization of air-sensitive samples

            No need to transfer samples between different instruments for imaging and cross-sectioning.

            Specifications

            Femtosecond-laser specifications
            Laser integration
            • Fully integrated in the chamber with the same coincident point for all 3 beams (SEM/PFIB/laser), enabling accurate and repeatable cut placement and 3D characterization.

            Laser Output
            First Harmonic
            • Wavelength

            1030 nm (IR)


            • Pulse duration

            <280 fs

            Second Harmonic
            • Wavelength

            515 nm (green)


            • Pulse duration

            <300 fs

            Optics
            Coincident point
            • Working distance= 4 mm (Same as SEM/FIB)

            Objective lens
            • Variable (motorized)

            Polarization
            • Horizontal/vertical

            Repetition rate
            • 1 kHz – 1 MHz

            Position accuracy
            • <250 nm

            Protective shutter
            • Automated SEM/PFIB protective shutter

            Software
            • Laser control software

            • Laser 3D serial sectioning workflow

            • Laser 3D serial sectioning workflow with EBSD

            • Laser scripting with optional Thermo Scientific AutoScript 4 Software

            Safety
            • Interlocked laser enclosure (Class 1 laser safety)


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